TSMC: investment of over 30 billion euros for the 2nm chip factory

TSMCTaiwanese semiconductor giant that produces chips for smartphones and PCs (see the new M2 from Apple), announced that it has started the procedure – bureaucratic and otherwise – that will lead to the construction of the factory that will produce the new generation chips with a 2nm node. The company – which is currently working on the 3nm node – has announced that it has taken the first steps to acquire the land that will house the plant. It will be placed in the city of Taichung (Taiwan), site that already hosts two TSMC facilities including the huge 9 million wafer-per-year GigaFab.

The company’s top management are negotiating with local authorities for the choice of strategic land adjacent to the Zhongqing Yigong site in Taichung. TSMC plans to produce 2nm chips in the city of Hsinchu and Taichung, a project that could apparently take investments of € 31.74 billion.

TSMC’s commitment to expand and improve its production capacity also passes through new fab that is being built in Arizona in the United States: this plant will be the largest for the company in the United States and, once completed, it will cost something like 12 billion dollars.

The American fab (photo above) should be operational by 2024 and, according to what has been reported, it will create 2,000 direct jobs as well as an induction that will involve thousands of external operators. In this regard, difficulties had been reported regarding new hires at the local level, but apparently the management is working to speed up the process, reiterating that the departure date remains 2024.


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